MCIMX6D6AVT10ADR,NXP USA Inc. MCIMX6D6AVT10ADR price,Integrated Circuits (ICs) MCIMX6D6AVT10ADR Distributor,MCIMX6D6AVT10ADR supplier
MCIMX6D6AVT10ADR,NXP USA Inc. MCIMX6D6AVT10ADR price,Integrated Circuits (ICs) MCIMX6D6AVT10ADR Distributor,MCIMX6D6AVT10ADR supplier
MCIMX6D6AVT10ADR
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MCIMX6D6AVT10ADR
    Part Number:KY-MCIMX6D6AVT10ADR
    Mfr. Part No:MCIMX6D6AVT10ADR
    Mfr.:NXP USA Inc.
    Stock:3842
    Description: 0.8mm ARM® Cortex®-A9 32-bit Microprocessor i.MX6D Series 624-FBGA, FCBGA
    Data Sheet:MCIMX6D6AVT10ADR Datasheet
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  • MCIMX6D6AVT10ADR Overview
    With a packing size of 624-FBGA, FCBGA, this embedded microprocessor is ideal for international shipping. High reliability is achieved with advanced packaging method Tape & Reel (TR). CPUs have 2 Core 32-Bit cores/bus width. Be aware of the operating temperature around -40°C~125°C TJ. A i.MX6D series item. A ARM® Cortex®-A9 processor is present in this CPU. The CPU contains LPDDR2, LVDDR3, DDR3 RAM controllers. This microprocessor is equipped with an interface of CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART. 1.8V 2.5V 2.8V 3.3V is the CPU's I/O address. I would rate this as a MICROPROCESSOR, RISC for the uPs/uCs/Peripheral ICs type. As a whole, there are 624 terminations. There is a 32-Bit architecture in it.
    MCIMX6D6AVT10ADR Features
    ARM® Cortex®-A9 Core
    32-Bit Structure

    MCIMX6D6AVT10ADR Applications
    There are a lot of NXP USA Inc.
    MCIMX6D6AVT10ADR Microprocessor applications.

    Radio
    Television
    Heater/Fan
    Calculator
    Kindle
    Christmas lights
    3D printers
    Washing machine
    Microwave ovens
    Home appliances
    Factory Lead Time15 Weeks
    Package / Case624-FBGA, FCBGA
    Surface MountYES
    Operating Temperature-40°C~125°C TJ
    PackagingTape & Reel (TR)
    Seriesi.MX6D
    Published2002
    JESD-609 Codee1
    Part StatusActive
    Moisture Sensitivity Level (MSL)3 (168 Hours)
    Number of Terminations624
    ECCN Code5A992
    Terminal FinishTin/Silver/Copper (Sn/Ag/Cu)
    HTS Code8542.31.00.01
    Terminal PositionBOTTOM
    Terminal FormBALL
    Peak Reflow Temperature (Cel)260
    Terminal Pitch0.8mm
    Time@Peak Reflow Temperature-Max (s)40
    JESD-30 CodeS-PBGA-B624
    Speed1.0GHz
    uPs/uCs/Peripheral ICs TypeMICROPROCESSOR, RISC
    Core ProcessorARM® Cortex®-A9
    Bit Size32
    Boundary ScanYES
    Low Power ModeNO
    FormatFIXED POINT
    Integrated CacheYES
    Voltage - I/O1.8V 2.5V 2.8V 3.3V
    Ethernet10/100/1000Mbps (1)
    Number of Cores/Bus Width2 Core 32-Bit
    Graphics AccelerationYes
    RAM ControllersLPDDR2, LVDDR3, DDR3
    USBUSB 2.0 + PHY (4)
    Additional InterfacesCAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
    Co-Processors/DSPMultimedia; NEON™ SIMD
    Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
    Display & Interface ControllersKeypad, LCD
    SATASATA 3Gbps (1)
    Length21mm
    Height Seated (Max)2.16mm
    RoHS StatusROHS3 Compliant
    
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