MC68302EH16CB1 Overview
The embedded microprocessor has been packed in 132-BQFP Bumpered for convenient overseas shipping. Using advanced packaging techniques Tray, high reliability is ensured. A CPU with 1 Core 8/16-Bit cores and width 1 Core 8/16-Bit busses is used. Understand how the operating temperature around 0°C~70°C TA is determined. This is a member of the M683xx series. With a core count of M68000, this CPU is multicore. A CPU with this architecture uses DRAM RAM controllers. With its GCI, IDL, ISDN, NMSI, PCM, SCPI interfaces, this microprocessor will be able to serve you better. The CPU runs at 5.0V when it comes to I/O. Use MC68302 when searching for variants of the embedded microprocessor. Overall, there are 132 terminations.
MC68302EH16CB1 Features
M68000 Core

MC68302EH16CB1 Applications
There are a lot of NXP USA Inc.
MC68302EH16CB1 Microprocessor applications.

Heater/Fan
Calculator
Kindle
Christmas lights
3D printers
Washing machine
Microwave ovens
Home appliances
Home video and audio
Entertainment products

Factory Lead Time	8 Weeks
Package / Case	132-BQFP Bumpered
Surface Mount	YES
Operating Temperature	0°C~70°C TA
Packaging	Tray
Series	M683xx
Published	1995
Part Status	Not For New Designs
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Number of Terminations	132
HTS Code	8542.31.00.01
Terminal Position	QUAD
Terminal Form	GULL WING
Terminal Pitch	0.635mm
Base Part Number	MC68302
JESD-30 Code	S-PQFP-G132
Speed	16MHz
Core Processor	M68000
Voltage - I/O	5.0V
Number of Cores/Bus Width	1 Core 8/16-Bit
Graphics Acceleration	No
RAM Controllers	DRAM
Additional Interfaces	GCI, IDL, ISDN, NMSI, PCM, SCPI
Co-Processors/DSP	Communications; RISC CPM
RoHS Status	ROHS3 Compliant