Factory Lead Time | 12 Weeks |
Package / Case | 256-BBGA |
Surface Mount | YES |
Operating Temperature | 0°C~95°C TA |
Packaging | Tray |
Series | MPC8xx |
Published | 1999 |
JESD-609 Code | e1 |
Part Status | Last Time Buy |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Number of Terminations | 256 |
ECCN Code | 3A991.A.2 |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
HTS Code | 8542.31.00.01 |
Terminal Position | BOTTOM |
Terminal Form | BALL |
Peak Reflow Temperature (Cel) | 245 |
Supply Voltage | 1.8V |
Terminal Pitch | 1.27mm |
Time@Peak Reflow Temperature-Max (s) | 30 |
Base Part Number | MPC852 |
JESD-30 Code | S-PBGA-B256 |
Supply Voltage-Max (Vsup) | 1.9V |
Power Supplies | 1.83.3V |
Supply Voltage-Min (Vsup) | 1.7V |
Speed | 50MHz |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Clock Frequency | 66MHz |
Bit Size | 32 |
Address Bus Width | 32 |
Boundary Scan | YES |
Low Power Mode | YES |
External Data Bus Width | 32 |
Format | FIXED POINT |
Integrated Cache | YES |
Voltage - I/O | 3.3V |
Ethernet | 10Mbps (1) |
Number of Cores/Bus Width | 1 Core 32-Bit |
Graphics Acceleration | No |
RAM Controllers | DRAM |
Additional Interfaces | HDLC/SDLC, PCMCIA, SPI, UART |
Co-Processors/DSP | Communications; CPM |
Length | 23mm |
Height Seated (Max) | 2.54mm |
RoHS Status | ROHS3 Compliant |